| 摘要 |
Trench structures 24, 26 are used to surround, or partially surround, component(s) of an integrated circuit to provide thermal insulation for the component(s). The isolated component(s) may be a transistor or more than one matched components, i.e. bipolar transistors 20, 22. The thermally isolated region may include heating resistors 30-36 and a temperature sensor 28. The trenches 24, 26 may be filled with silicon dioxide, silicon nitride or a mixture of polysilicon and silicon dioxide, and may also include voids. |
