| 摘要 |
The present invention relates to a TF-BGA method for manufacturing a packaging substrate, and includes steps of forming a single-sided circuit on a copper plate by electroplating, removing a layer of photoresist and sequentially laminating a dielectric layer and a metal plate on the copper plate, etching the copper plate, selectively applying a layer of solder resist, defining a cavity opening by punching, routing or etching, attaching a heat sink, forming dam rings and protecting the laminate by mold compound, attaching a die and bonding gold wires and encapsulating the cavity opening by encapsulate and attaching solder balls. In particular, a metal plate substitutes for a BT resin material to achieve low packaging cost and increasing the heat dissipating efficiency. A transfer flat type ball grid array method is employed to achieve an effect of fine circuitry and each single substrate is processed and tested individually. After the defective substrate units have been removed, the substrate units proved to be good are arranged in a long strip form and the borders thereof are molded to link in a latitudinal extension shape. A problem of the conventional entire strip of substrate set becoming useless when part of the substrate units are defective can be eliminated.
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