| 发明名称 |
High modulus thermoplastic resin composition |
| 摘要 |
<p>A thermoplastic resin composition comprising a rubber modified thermoplastic resin and from 2 parts by weight to 20 parts by weight of a fluoropolymer, based on 100 parts by weight of the resin composition, imparts a high tensile modulus, ductility and a low friction surface to articles molded therefrom.</p> |
| 申请公布号 |
EP0911368(A1) |
申请公布日期 |
1999.04.28 |
| 申请号 |
EP19980308248 |
申请日期 |
1998.10.09 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
GAGGAR, SATISH KUMAR;MOORE, MARSHALL DEWEY |
| 分类号 |
C08L101/00;C08L51/04;C08L27/12;C08L53/02;C08L101/10;(IPC1-7):C08L101/00;C08L25/12 |
主分类号 |
C08L101/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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