| 摘要 |
A heat dissipation device for the central processing unit (CPU) with larger area mainly comprises a finned plate 1 and a board member 2 mounted to the finned plate 1. The finned plate 1 includes a plurality of rows and/or columns of fins extending upwardly from an upper side, wherein gaps are formed among every adjacent fins for the purpose of air circulation, and two separable grooves 13 are defined among every adjacent fin block. The board member includes a hole 21 and a support member 23 provided in the hole and connected to the periphery defining the hole by a plurality of ribs 22 extending to the support member. A stud 24 is formed on an upper side of the support member and includes a second hole defined therein for rotationally receiving a rotor shaft of fan 25. At lease one holder 3 is provided at the grooves 13 for mounting the heat dissipation device onto the central processing unit. One of the ribs 22 has a slot 27 through which the electrical wires of the fan 25 may extend to be connected to an electric power source. |
