| 发明名称 |
SOLDER ALLOY, SOLDER COMPOSITION, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD |
| 摘要 |
A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio. |
| 申请公布号 |
US2016271737(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201414442628 |
申请日期 |
2014.08.28 |
| 申请人 |
HARIMA CHEMICALS, INCORPORATED |
发明人 |
IKEDA Kazuki;INOUE Kosuke;ICHIKAWA Kazuya;TAKEMOTO Tadashi |
| 分类号 |
B23K35/26;C22C13/00;H05K3/34;B23K35/362;B23K35/36;C22C13/02;B23K35/02 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A solder alloy, being a tin-silver-copper solder alloy, substantially consisting of:
tin, silver, copper, bismuth, nickel, cobalt, and indium, wherein with respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio. |
| 地址 |
Kakogawa-shi JP |
