| 摘要 |
In a semiconductor device, inner lead reinforcing patterns are formed at an area on a TAB tape other than an area where the inner lead is formed, in the vicinity of a device hole of the TAB tape. The inner lead reinforcing patterns are bonded to inner lead reinforcing pattern pads provided on a semiconductor chip. Accordingly, the semiconductor chip is supported by both the inner leads and the inner lead reinforcing patterns such that stress applied to the inner leads from dead weight of the semiconductor chip and vibrations occurring during the fabrication process are reduced, and cutting and/or breaking of the inner leads can be prevented. |
