发明名称 Computer chip heat sink
摘要 The heat sink is provided by a metal mesh made of a metal with good heat conduction characteristics. The parallel undulating mesh wires (11) are coupled together at their points of contact, to provide a dianond mesh screening plate (1). The mesh wires can be formed from a rectangular cross-section metal band, with a number of overlapping screening plates secured to a base plate (3) of a heat conductive material via corner fixing posts (31).
申请公布号 FR2773940(A3) 申请公布日期 1999.07.23
申请号 FR19980000642 申请日期 1998.01.22
申请人 HSU MEI HUA 发明人 HSU MEI HUA
分类号 F28F3/02;H01L23/367;(IPC1-7):H05K7/20;F28F21/08;F28F3/06 主分类号 F28F3/02
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