| 摘要 |
PROBLEM TO BE SOLVED: To improve operability and connection reliability, by firmly fixing, to the surface of a semiconductor chip, a creep-up preventing means having external dimensions larger than the surface of the chip, in such a manner that the peripheral portion of the means projects from each end of the surface of the chip. SOLUTION: A creep-up preventing plate 2 is firmly fixed through an adhesive 11 to a surface of a semiconductor chip 1, which is opposite to a surface of the chip 1 having electrodes 2 formed thereon. This semiconductor device 10 is mounted on a printed wiring board 4 by a flip-chip mounting method after having been subjected to a pressure and heat treatment. When mounting, the plate 12 can prevent a sealing resin 6 that has been forced out of the chip 1 from creeping up the side surfaces of the chip 1. The heat radiated from the chip 1 is efficiently radiated to the outside sequentially through the adhesive 11 and the plate 12. As a result, the device 10 can be mounted onto the board 4 continuously, and thus operability and connection reliability can be improved. |
