Semiconductor device testing apparatus

摘要

In an IC tester of the type in which ICs to be tested are heated by a planar heater plate 50 prior to being tested, a plate-like shutter 70 having windows 71 formed therethrough to expose IC receiving recesses 51 formed in the heater plate 50 is disposed movably over the top face of the heater plate. The arrangement is such that the shutter 70 is shifted by a linear drive source 74 between a position in which the shutter closes the top of the IC receiving recesses 51 and a position in which the shutter exposes the recesses. A controller is provided for actuating the drive source to move the shutter so as to open the IC receiving recesses, whenever a Z-axis drive unit 60 enters into either the operation of dropping off an IC grasped thereby into one of the IC receiving recesses or the operation of picking up an IC from one of the IC receiving recesses.