PACKAGE STRUCTURE FOR SEALING ELEMENT AND PRODUCTION THEREOF,申请号JP19980159977-传众专利搜索

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发明名称	PACKAGE STRUCTURE FOR SEALING ELEMENT AND PRODUCTION THEREOF
摘要
申请公布号	JPH11340348(A)	申请公布日期	1999.12.10
申请号	JP19980159977	申请日期	1998.05.25
申请人	MURATA MFG CO LTD	发明人	HARA TETSUZO
分类号	H01L23/02;H01L23/10;(IPC1-7):H01L23/02	主分类号	H01L23/02
代理机构		代理人
主权项
地址

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