| 摘要 |
<p>A resin molded article for fitting to an inside wall of a liner in a chamber of a dry etching apparatus used in semiconductor manufacture is disclosed. The resin molded article is a seamless annular molded article having a heat resistance temperature of at least 100 °C, a tensile elongation at break of at least 0.3 %, a flexural modulus of at least 10,000 kg/cm2, an outside diameter from 0 to 0.3 % larger than the inside diameter of the liner, and a wall thickness of not more than 2 mm.</p> |
