发明名称 |
Molten solder dispensing system |
摘要 |
An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
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申请公布号 |
US6000597(A) |
申请公布日期 |
1999.12.14 |
申请号 |
US19980014878 |
申请日期 |
1998.01.28 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
STRAUB, MARC ALAN;DIPIAZZA, FRANK BURKE;JAIRAZBHOY, VIVEK AMIR;GOENKA, LAKHI NANDIAL;STEVENSON, RANDY CLAUDE |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):B23K3/06 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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