发明名称 |
METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE WITH FLUORESCENT MATERIAL |
摘要 |
PURPOSE: A method for fabricating a light emitting diode(LED) package is provided to minimize the difference of hues of light rays reflected from the LED package. CONSTITUTION: The method includes the steps of wrapping an LED with transparent epoxy, molding the wrapped LED out of a fluorescent material, and forming lenses using the fluorescent material. |
申请公布号 |
KR20000007067(A) |
申请公布日期 |
2000.02.07 |
申请号 |
KR19990052283 |
申请日期 |
1999.11.23 |
申请人 |
KYONG BONG SEMICONDUCTOR CO. LTD. |
发明人 |
KIM, CHANG TAE |
分类号 |
H01L33/56;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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