发明名称 METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE WITH FLUORESCENT MATERIAL
摘要 PURPOSE: A method for fabricating a light emitting diode(LED) package is provided to minimize the difference of hues of light rays reflected from the LED package. CONSTITUTION: The method includes the steps of wrapping an LED with transparent epoxy, molding the wrapped LED out of a fluorescent material, and forming lenses using the fluorescent material.
申请公布号 KR20000007067(A) 申请公布日期 2000.02.07
申请号 KR19990052283 申请日期 1999.11.23
申请人 KYONG BONG SEMICONDUCTOR CO. LTD. 发明人 KIM, CHANG TAE
分类号 H01L33/56;(IPC1-7):H01L33/00 主分类号 H01L33/56
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