| 摘要 |
PROBLEM TO BE SOLVED: To enable a package assembling apparatus that assembles a package in which a semiconductor element is sealed up through a welding means to improve its metal cap welding operation in productivity. SOLUTION: A package assembling device 2 welds a metal cap through a seam welding method to the opening surface of a case, where a semiconductor element is previously mounted, wherein the assembling device 2 is composed of a pedestal 15, a rotary stage 162 placed on the pedestal 15, a cap sealing device 21 installed on the rotary stage 162, and roller electrodes 163. The cap sealing device 21 is constituted of a sealing device main body 211, where a case is placed and four guide plates 213 that are mounted on the sealing device main body 211, through the intermediary of springs 212 fitted in guide pins installed upright at positions on the periphery of the case placing region of the sealing device main body 211, and the guide plates 213 formed of insulating material are provided, so as to enable their side faces on a case side to be located which correspond to the sides of the case and their upsides to be located above that of the case.
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