| 摘要 |
PROBLEM TO BE SOLVED: To obtain an aligner and a method for exposing semiconductor wafers with which the exposure region on a semiconductor wafer is used effectively and which is suitable for improving product collection rate. SOLUTION: A method of exposing semiconductor wafers is provided with exclusion region detecting steps S106 and S108 for detecting an exclusion region and focus position determining steps S118-S124 for determining the focus position of exposure, on the basis of the results of exclusion region detection. At focus position determination, when detection points P1-P5 of a focus sensor are decided as being in the excluded region having difference in levels of specified length A or larger in the direction of the thickness of the semiconductor wafer, an XY stage is moved in such a way that the detection points P1-P5 are in a region other than the excluded region. Then the focus position of exposure is determined based on focus signals from a focus sensor in the region to which the points are moved.
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