发明名称 COIL DEVICE
摘要 PROBLEM TO BE SOLVED: To solve an environmental problem by using a conductive adhesive for the connection of lead terminals to the main body of a coil, and at the same time, to improve the strength of adhesion of the adhesive with respect to that of soldering by eliminating the weak point, that is, the low adhesive strength of the conventional adhesive. SOLUTION: A coil device has a main body 1 of a coil constituted by winding a winding 5 around a cylindrical magnetic core 2 and platy lead terminals 11, which are firmly stuck to both end faces of the core 2 with a conductive adhesive 20 together with the terminals 6 of the winding 5. Each lead terminal 11 is buried closer to a base part 12 than the adhesive 20. The front end side connection 13 of each terminal 11 is formed into a narrow width and a small wall thickness.
申请公布号 JP2000049019(A) 申请公布日期 2000.02.18
申请号 JP19980225380 申请日期 1998.07.25
申请人 TDK CORP 发明人 KOTANI TSUTOMU
分类号 H01F27/28;H01F27/29;(IPC1-7):H01F27/29 主分类号 H01F27/28
代理机构 代理人
主权项
地址