发明名称 ELECTROLESS GOLD PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To stabilize a plating liquid and to increase the precipitation rate of a gold plating film of high purity by compounding a specified amt. of lithium compds. into an alkaline self-catalyst type plating liquid having specified cyanide concn. and pH and containing a specified amt. of gold compds. and reducing agent. SOLUTION: A lithium compd. is compounded in a self-catalyst type alkaline electroless gold plating liquid containing cyanide compds. to prepare a liquid containing 0.2 to 20 g/L gold compd. (calculated in terms of gold ion concn.), 1 to 50 g/L reducing agent, and 0.1 to 100 g/L lithium compd., preferably 0.1 to 70 g/L, and having 0.1 to 20 g/L isolated cyanide concn. and pH 10 to 14. The gold compd. is gold (I) potassium cyanide or the like, the reducing agent is dimethylamine borane or the like, and the lighium compd. is lighium oxalate or the like. If necessary, the electroless gold plating liquid may contain 0.1 to 50 mg/L of thallium compd. or lead compd., and further 0.1 to 80 g/L of stabilizer.
申请公布号 JP2000087251(A) 申请公布日期 2000.03.28
申请号 JP19980250906 申请日期 1998.09.04
申请人 OKUNO CHEM IND CO LTD 发明人 OKUNO KAZUYOSHI;TORIKAI EIICHI;OTSUKA KUNIAKI;HATTORI NORIKO
分类号 C01G7/00;C23C18/44;(IPC1-7):C23C18/44 主分类号 C01G7/00
代理机构 代理人
主权项
地址