| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive having heat resistance capable of sufficiently resisting to such high temperatures as the temperature of a reflowed solder or the temperature of a solder trowel and not needing the adjustment of viscosity. SOLUTION: This heat-resistant adhesive comprises a glycidyl amine type epoxy resin having at least two epoxy groups as a curable resin and dicyandiamide as a curing agent for the curable resin. The curable resin comprises a glycidyl amine type epoxy resin which has three or more functional groups, has two or more benzene rings and is liquid or viscous at ordinary temperature, and a glycidylamine type epoxy resin which has three or more functional groups, has one or more benzene rings and is liquid at ordinary temperature. A glycidyl amine type epoxy resin which has three or more functional groups, has two or more benzene rings and is liquid or viscous at ordinary temperature is added in an amount of 20-90 pts.wt. to 100 pts.wt. of the curable resin.
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