| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a ceramic substrate comprising a minute wiring simply, efficiently, and at low cost by printing a wiring pattern on a green sheet and then jointing it to the ceramic substrate. SOLUTION: A wiring pattern 2 is printed on a ceramic green sheet 1, and then the ceramic green sheet 1 comprising the print pattern is placed on a ceramic substrate 3 with its print surface facing a substrate side for tight-fitting, and it is sintered to manufacture a ceramic minute wiring board 5. Here, the ceramic substrate 3 is normally provided with a through hole or via holes 4a and 4b. With this, the circuit on the surface of ceramic substrate is conductive to the circuit 2 formed by printing on the green sheet 1. Since the green sheet is hygroscopic, the solvent content in a past moves to the green sheet just after printing, suppressing fluidity of the paste.
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