| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser dicing device capable of performing accurate laser dicing since abrasion is prevented, a working distance can be made constant, and irradiation efficiency can be improved, even when laser dicing is performed against a wafer, and a method.SOLUTION: The laser dicing device for irradiating a wafer with a laser beam from a laser irradiation part to form a modified layer inside the wafer includes: a wafer table, transparent to the laser beam, for holding the wafer; and a transparent liquid film filling a gap between the laser irradiation part and the wafer table. The laser beam is irradiated inside the wafer from the laser irradiation part through the transparent liquid film and the wafer table to form a modified layer inside the wafer.SELECTED DRAWING: Figure 1 |
