| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device, which can apply accurately a soldering to only the soldering parts of a piece to be treated without bringing into contact a liquid solder with the non-soldering pats of the piece to be treated. SOLUTION: A soldering device 1 consists of a solder tank 11, which is arranged in the inside of a base part 10 and is put with a liquid solder 2 therein, a mask jig 12 for protecting a resin case for a piece 3 to be treated to be soldered, a holding jig 13 for holding the jig 12 via a spring and a component carrying jig 14, which carrys the piece 3 while holding the piece 3 and attaches or detaches to or from the jig 12. The jig 13 is rotatably arranged on the base part 10 in such a way that the jig 12 can change its angle to the liquid level of the liquid solder 2.
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