| 摘要 |
PROBLEM TO BE SOLVED: To improve accuracy of probe testing by reducing the thermally deformed quantity of a probe card. SOLUTION: In this inspection, which is performed by bringing a probe arranged on a probe card 3 into contact with a wafer while a semiconductor circuit formed on the surface of the wafer is heated from the back of the wafer 11, an inspection method of the semiconductor circuit which is performed while the surface of the probe card 3 which surface does not in contact with the wafer 11 is heated, is installed. In an inspection device of the semiconductor circuit having a retaining table fixing the wafer 11, a means heating the wafer 11 arranged on the retaining table, the probe card 3 on which a probe to be brought into contact with the wafer is arranged, and a computer having algorithm for inspection which is connected with the probe card 3, a means for heating the surface of the probe card 3 the surface of which does not come into contact with the wafer 11 is installed.
|
