Construction for mounting electronic component on flexible substrate

摘要

The invention provides a mounting construction in which an electronic component is mounted on a flexible substrate. The mounting construction comprises a flexible substrate 10 including a flexible sheet 11, bendable electrode pattern forming portions 17 and 17 formed on the flexible sheet, and electrode patterns 13 and 13 formed on the electrode pattern forming portions, an electronic component 30 having electrode portions 33 and 33, and a clamping member 40 having clamping pieces 41 and 41 for clamping the electronic component 30 therebetween. The electrode pattern forming portions 17 and 17 are deflected, so as to cause the electrode patterns 13 and 13 to be contacted with the electrode portions 33 and 33 of the electronic component 30 placed on the flexible substrate 10. By this, the electronic component 30 is clamped by the clamping pieces 41 and 41 of the clamping member 40 through the deflected electrode pattern forming portions 17 and 17. Thus, the electronic component 30 may be easily and positively secured to the flexible substrate 10, without employing additional reinforcing means such as adhesives.