发明名称 BURN-IN APPARATUS FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a burn-in apparatus comprising a means for easily detecting a contact condition between a power source terminal and a ground terminal of an IC and an IC socket. SOLUTION: A contact condition confirming wiring 3 for connecting power source/ground terminals 12 and 13 of each IC socket 4 in series, a voltage source 6 for applying a specified voltage to the wiring, and an ammeter 7 for measuring a current flowing in the wiring when a specified voltage is applied from the voltage source 6, are provided. Switches 8 and 9 are provided for switching between connecting to the power source/ground terminals 12 and 13 of each IC socket 4 to a power source voltage supply line 1 and a ground voltage supply line 2 and for connecting it to the contact quality confirming wiring 3. At detecting a contact condition, the switches 8 and 9 are switched over to the side of the contact quality confirming wiring 3 for supplying a specified voltage from the voltage source 6. A prescribed current flows if there is good contact, while no current will flow if there is poor contact. Thus, the quality of terminal contact is easily detected.
申请公布号 JP2000147054(A) 申请公布日期 2000.05.26
申请号 JP19980318228 申请日期 1998.11.10
申请人 SHARP CORP 发明人 TANAKA TOYOHIKO
分类号 G01R31/26;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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