| 摘要 |
PROBLEM TO BE SOLVED: To minimize the undulation of a substrate and correct the warpage by placing a weight divided into plural sections in vertical direction based on the loading face on a warped substrate having uneven thickness and heat- treating the loaded substrate. SOLUTION: A weight 2 divided into plural sections in vertical direction relative to the loading surface is placed on plural ceramic substrates 1 having warpage and a guide 3 is placed on the outer circumference of the ceramic substrates 1 and the weight 2. Each of the divided weights 2 has a plane area at least larger than that of the voids and porous part existing in the substrate and the weight its usually divided into about 3-5 sections. The load of the weight depends upon the kind of the substrate, etc., and is usually 1-5 kg, Although there is no particular restriction on the number of stacked ceramic substrates 1 for correcting the warpage, usually 2-100 substrates or thereabout can be treated by this process. The material of the ceramic is e.g. alumina, zirconia, silicon nitride and silicon carbide.
|
