发明名称 CORRECTION PATTERN FOR PRINTED WIRING BOARD AND METHOD OF CORRECTING THE PATTERN
摘要 PROBLEM TO BE SOLVED: To repair a disconnected wiring in a printed wiring board in a convenient manner. SOLUTION: A mixture layer which includes an oxidizing agent comprising photosensitive resin and a polyvalent transition metal salt is formed on the surface of a base 1 which includes a part to be repaired of a disconnected pattern 2 on the base 1 of a printed wiring board. Then, one part of the mixture layer is selectively converted to a corrosion resistible image 5 by a method for photochemical reaction using a photomask 4. Moreover, a conducting high polymer is made to polymerize with the image to repair the part to be repaired. Since the conducting high polymer can be polymerized with only a part required for repair on the surface of the printed wiring board, this method can appropriately cope with the disconnection of a high-integrated circuit.
申请公布号 JP2000174422(A) 申请公布日期 2000.06.23
申请号 JP19980349978 申请日期 1998.12.09
申请人 NEC TOYAMA LTD 发明人 MATSUMOTO SATOSHI
分类号 H05K3/22;H01B1/12;H05K1/09;(IPC1-7):H05K3/22 主分类号 H05K3/22
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