| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminate and a printed wiring board capable of corresponding to high frequency with making electronic devices smaller and high performance.SOLUTION: There is provided a copper-clad laminate having a polyimide insulation layer and a copper foil, a) the polyimide insulation layer has an adhesive polyimide layer contacting the copper foil (i) and a low expansion polyimide layer (ii), b) the adhesive polyimide layer (i) consists of polyimide containing PMDA of 50 mol% or more based on an acid anhydride component and BAPP of 50 mol% based on a diamine component, c) the low expansion polyimide layer (ii) consists of polyimide containing PMDA of 70 to 100 mol% based on the acid anhydride component, d) a surface contacting the adhesive polyimide layer (i) of the copper foil is toughness treated, Rz is 1.0 μm or less and Ra is 0.2 μm or less and e) Ni amount added to the surface contacting the adhesive polyimide layer (i) of the copper foil is 0.01 mg/dmor less, Co amount of 0.01 to 0.5 mg/dm, Mo amount of 0.01 to 0.5 mg/dmand Co+Mo is 0.1 to 0.7 mg/dm.SELECTED DRAWING: None |
