| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting object, having a satisfactory joint characteristic through the use of solder suitable for reducing an environment load. SOLUTION: A terminal 6 of an electronic component 5, where a metal coat 2 having composition which contains 1-5 weight % of bismuth and at least one type of metal selected from among 0-5 weight % of gold, silver, copper, palladium, white gold, rhodium, iridium, ruthenium and osmium and, in which a remaining part is substantially formed of tin is formed is jointed to a substrate 3 by using a composition which contains 1-5 weight % of bismuth and at least one type of metal selected from among 0-5 weight % gold and the like, in which a remaining part is practically formed of tin and lead is smaller than 2 weight %.
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