| 摘要 |
PROBLEM TO BE SOLVED: To provide the module mounting method of an electronic unit, whose manufacture quality is improved and whose reliability can be improved. SOLUTION: Module mounting is completed by a process with flow solder for jointing a module to a face A of a printed wiring board 1 (figure (c)), a second process with reflow solder for jointing a second module group to the face B of the board 1 (figure (d)) and a third process with reflow solder for inserting a third module group into a board 2, in a state in which the respective boards 2 obtained by dividing the board 1 into a chassis 3, jointing the board 2 with the chassis 3 and jointing the board 2 with the third module group. As a result, the number of processes with reflow solder are reduced, and a process with dip solder is omitted, in comparison to conventional cases.
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