发明名称 SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To visually observe an interior and a solder liquid surface of a chamber by forming a chamber for a low oxygen atmosphere of an upper side cover and a lower side cover at an upper side of a solder tank, providing a window on an oblique surface of the chamber, and providing an opening at a straightening plate for supplying inert gas to a lower side of the chamber. SOLUTION: A chamber for a low oxygen atmosphere therein is formed of an upper side cover of an upper side of a work-conveying means 4 and a lower side cover of a lower side at an upper side of a solder tank. A window 28 is provided at an oblique surface 26a formed at an acute angle at an upper side from a bottom of the chamber. Inert gas is ejected from a jetting part 42 into the chamber, held in a high concentration at an upper side of the chamber, slowly supplied to a lower side of the chamber through the opening 41 provided at a straightening plate 43 to form a low oxygen atmosphere. The chamber interior can be easily visually observed through the window 28 and the opening 41 provided at the plate 43, and a solder liquid surface can be observed through the opening 47.
申请公布号 JP2000208924(A) 申请公布日期 2000.07.28
申请号 JP19990009952 申请日期 1999.01.18
申请人 SONY CORP;KOKI:KK 发明人 TAN SUGURU;MOTOMIYA IKUJIRO;OGURO KIYOUJI;HASEGAWA KIKETSU
分类号 B23K1/00;B23K1/08;B23K31/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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