| 摘要 |
PROBLEM TO BE SOLVED: To suppress the resistance increase of a connection at a via part and to suppress the local increase of a current density without improving production accuracy, even if wiring width or via hole diameter is reduced in accordance with the reduction of design rules. SOLUTION: Wiring A of a top layer in the wiring connected by a plug B is made into a structure through which a via hole penetrates. Even if the alignment of the upper layer wiring A to the via hole is deviated, since the area in contact with the wiring A on the side face of the plug B is hard to be reduced, the increase of resistance at the via part is suppressed and the local increase of the current density can be suppressed.
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