| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having excellent normal- temperature storage properties, moldability and solder stress resistance, suitable for sealing a semiconductor by compounding a specific epoxy resin with a phenol resin, an inorganic filler and a curing promoter containing a latent curing promoter as essential components. SOLUTION: This epoxy resin component is obtained by compounding an epoxy resin containing 30-100 wt.% of an epoxy resin of formula I [R1 is a 1-5C alkylene; X is a group of formula (OG is a group of formula III) or the like; n is 1-5] having 60-110 deg.C melting point in the whole epoxy resin with a phenol resin such as a novolak type phenol resin containing two or more phenolic groups in one molecule in an equivalent ratio of epoxy groups of the whole epoxy resins to hydroxyl groups of the whole phenol resin of 0.5-2 and 250-1,400 pts.wt. of an inorganic filler such as spherical silica based on 100 pts.wt. of the total of both the resins and 0.4-20 pts.wt. of a curing promoter containing 30-100 wt.% of a latent curing promoter such as phosphonium borate.
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