发明名称 LC BANDPASS FILTER
摘要 PROBLEM TO BE SOLVED: To make the Q-value of a coil through which a core is inserted large and to reduce costs by forming a thin film core on a circuit board, cutting it to small parts and providing thin film winding inductors obtained by applying conductor winding. SOLUTION: Chip capacitors 11 of a 1005 system or a 0603 system are mounted in a glass ceramics multilayer board 10. The mounting of the capacitors 11 on the board 10 is performed by applying solder paste, subsequently raising temperature with a reflow furnace, etc., and connecting the capacitors 11. After that, thin film magnetic material is formed on glass substrate to form a thin film core and after cutting it to small parts, thin film winding inductors 1 are mounted on the board 10 and connected with conductor winding (copper coil) wound around the glass substrates. According to this configuration, since a bandpass filter is constructed by providing the thin film winding inductors obtained by applying winding around the thin film magnetic material, the Q- value of a coil through which the core is inserted can be made large.
申请公布号 JP2000228615(A) 申请公布日期 2000.08.15
申请号 JP19990029094 申请日期 1999.02.05
申请人 TOKIN CORP 发明人 SUGAWARA HIDEKUNI;RI MORIHARU;YANO TAKESHI
分类号 H01F27/00;H01G4/40;H03H7/01;H03H7/075;(IPC1-7):H03H7/01 主分类号 H01F27/00
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