| 摘要 |
PROBLEM TO BE SOLVED: To make better the boundary adhesion in the copper wire plated with aluminum by previously coating the surface of a copper wire shaped body with a material to form a bind material contg. a specified amt. of Si and applying aluminum plating on the copper wire shaped body. SOLUTION: A copper wire 1 is incorporated into a bind material pipe 5 of an aluminum alloy having >0 to <2 wt.% Si concn., and the obtd. incorporated body is wire-drawn and integrated to form into a bind material-coated copper wire 6. Next, this bind material coated copper wire 6 is used as the wire to be plated and is applied with ordinary hot dip aluminum plating to form into an aluminum plated copper wire. As to this aluminum plated copper wire, the bind material satisfactorily adheres to both copper and aluminum, and the boundary adhesion among the copper, bind material and aluminum is satisfactory. Moreover, the surface of the copper has been previously coated with the bind material, the elution of copper into the aluminum molten metal is prevented, and the contamination of the molten metal is prevented as well. This method is applicable also in the case aluminum plating is applied on copper materials having the shape of bulky materials such as blocks as well as wire shaped bodies.
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