发明名称 ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive composition excellent in adhesiveness, heat resistance, folding resistance, and workability by including a thermosetting resin with an acrylonitrile/butadiene rubber and an antioxidant being N-phenyl-N '-(3-methacryloyloxy-2-hydroxypropyl)-p-phenylenediamine in a specified ratio. SOLUTION: This composition contains a thermosetting resin, an acrylonitrile/ butadiene rubber, and an antioxidant being N-phenyl-N'-(3-methacryloyloxy-2- hydroxypropyl)-p-phenylenediamine in an amount of 0.01-5 wt.% based on the solid matter of the composition. If required, the composition additionally contain an organic or inorganic finely divided filler, a pigment, an antidegradant, etc. The thermosetting resin used is exemplified by a phenolic resin, an epoxy resin, a polyester resin, an epoxy resin, a polyester resin, a polyimide resin, or a modified resin derived therefrom. The thermosetting resin and the synthetic rubber are used after they are dissolved in a solvent such as methyl ethyl ketone or toluene, having a boiling point of 150 deg.C or below.
申请公布号 JP2000239629(A) 申请公布日期 2000.09.05
申请号 JP19990044006 申请日期 1999.02.23
申请人 TOSHIBA CHEM CORP 发明人 INMAKI NORIKO
分类号 H05K3/28;C09J109/02;C09J201/00;H05K1/03;(IPC1-7):C09J109/02 主分类号 H05K3/28
代理机构 代理人
主权项
地址