| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition excellent in high temperature storage properties and moisture-proof reliability as well as in the balance thereof with flame retardancy. SOLUTION: This resin composition comprises, as essential components, an epoxy resin, a phenol resin, 0.1-5 wt.%, based on the total resin composition, of a red phosphorus-based flame-retardant obtained by coating the surface of red phosphorus with aluminum hydroxide and subsequently coating the surface thereof further with a phenol resin, 0.1-5 wt.%, based on the total resin composition, of a hydrotalcite of the formula: MgxAly(OH)2x+3y-2z(CO3)z.mHz0 (wherein O<y/x<=1; 0<=z/y<1.5; and (m) is a positive number), an inorganic filler and a curing accelerator.
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