| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing resin composition which can improve curing properties without deteriorating various characteristics, such as mechanical characteristic, low water absorption and the like being characteristics of a thermocurable resin bearing a dihydrobenzoxazine ring, can clear a problem involved in a conventional epoxy resin sealing material such that the amount of a flame- retardant should be reduced from the view point of environmental protection and has excellent storage stability, and also to provide a semiconductor device sealed with the composition. SOLUTION: A semiconductor device is prepared by sealing a semiconductor element with a semiconductor-sealing resin composition comprising 100 pts.wt. of a thermocurable resin composition, as an essential component, which comprises a thermocurable resin bearing a dihydrobenzoxazine ring synthesized from a phenol, formaldehyde and an aromatic diamine, an epoxy resin and a phenol resin and has a melt viscosity of a mixture of these three components at 150 deg.C of not higher than 2P, 0.01-35 pts.wt. of an additive comprising at least one selected among curing accelerators, releasing agents, adhesion-imparting agents, colorants and flame-retardants and 200-1,200 pts.wt. of an inorganic filler.
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