发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide composition which is excellent in flame retardancy, heat resistance, and thermal stability upon melt-molding, and can give molded articles which shows less reduction in mechanical properties upon adsorbing moisture and have very good appearance (particulary, color tone), and molded articles prepared therefrom. SOLUTION: The polyamide composition is prepared by compounding 100 pts.wt. of a polyamide (A) comprising dicarboxylic acid units (a) containing 60-100 mol% of terephthalic acid units and diamine units (b) containing 60-100 mol% of 6-18C aliphatic alkylenediamine units, 10-200 pts.wt. of at least one flame retardant (B) selected from brominated polystyrene, brominated polyphenylene ether and brominated phenoxy resins, 0.1-50 pts.wt. of sodium antimonate (C), and 0.01-10 pts.wt. of at least one inorganic compound (D) selected from calcium oxide, boron oxide, aluminum oxide, yttrium oxide, zirconium oxide, tin oxide, zinc stannate, zinc hydroxystannate, zinc borate and calcium borate.
申请公布号 JP2000265055(A) 申请公布日期 2000.09.26
申请号 JP19990070034 申请日期 1999.03.16
申请人 KURARAY CO LTD 发明人 OKA HIDEAKI;TAMURA KOZO;UTSUNOMIYA TAKESHI
分类号 C08J5/00;C08K3/00;C08K3/20;C08K3/24;C08K3/38;C08L25/18;C08L71/08;C08L71/12;C08L77/06;C08L77/10;(IPC1-7):C08L77/10 主分类号 C08J5/00
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