| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having an excellent moldability and solder resistance. SOLUTION: In a resin composition essentially comprising (A) a crystalline epoxy resin, (B) a phenol resin of the formula (wherein n is an average and is 0 or a positive number no larger than 8), (C) an inorganic filler and (D) an accelerator, the degree of crystallinity of the crystalline epoxy resin is 0 to 70%.
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