发明名称 DUMMY PATTERN FORMING METHOD AND SEMICONDUCTOR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To enable formation of a dummy pattern into a suitable shape so that it is contained in the edge of a wafer, to maintain uniform etching amount on the wafer side, and to prevent a resist peel off from the edge of a wafer, by obtaining an aligner which can transform exposure field into various shapes. SOLUTION: A blind drive portion consists of light shielding plate 37, a blind drive stage 38, and a blind drive stage 39. Each of the light shielding plate 37 are movable in the direction parallel/perpendicular to the edge and is rotatable. Each of the four shades are arranged counterposing each other, and each shade is controlled by a main control system via the blind drive unit. Four light shielding plates by moving in the direction parallel/perpendicular to the edge and by rotating determine the illuminating region and form an exposed field in various shapes and a dummy pattern.
申请公布号 JP2000269122(A) 申请公布日期 2000.09.29
申请号 JP19990074504 申请日期 1999.03.18
申请人 HIROSHIMA NIPPON DENKI KK 发明人 UCHIYAMA MASARU
分类号 H01L21/027;G03F7/20;(IPC1-7):H01L21/027 主分类号 H01L21/027
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