| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for modifying the locations of IC leads capable of improving the reliability of tests on electric characteristics. SOLUTION: A device in relation to this invention for modifying the locations of IC leads includes and is constituted of an IC socket 4 provided with guide plates 41 and a pusher 5 mounted to be used on the surface of the IC socket 4 at which the guide plates 41 are arranged. As the pusher 5 comprises a surface opposing to the IC socket 4 in a shape along an inclined surface, it is possible to bring the IC leads into contact with pins 3 at correct locations. Therefore, it is possible to reduce the occurrence of contact failures and to improve the reliability of tests on electric characteristics.
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