POLYIMIDE RESIN, RESIN COMPOSITION WITH IMPROVED MOISTURE RESISTANCE COMPRISING THE SAME, ADHESIVE SOLUTION, FILMY BONDING MEMBER, LAYERED ADHESIVE FILM, AND PROCESSES FOR PRODUCING THESE

摘要

A polyimide resin which can be cured for bonding at a relatively low temperature, is soluble in solvents, and is excellent in heat resistance and adhesion; a resin composition comprising the polyimide resin; an adhesive solution; a filmy bonding member; and a layered adhesive film. The polyimide resin is a novel one reduced in water absorption which is obtained by reacting an aromatic diamine with one or more tetracarboxylic dianhydrides comprising an ester acid dianhydride represented by general formula (1) (wherein X represents -(CH2)k- or a divalent group comprising an aromatic ring and k is an integer of 1 to 10). The resin composition and the filmy bonding member, which each comprises a thermosetting resin comprising the polyimide resin and is excellent in adhesion, are suitable for use in a flexible printed circuit board, a tape for TAB (tape automated bonding), a composite lead frame, a laminated material, etc. The layered adhesive film is suitable for the covering of a superconducting wire.