| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board where a melted solder can be prevented from flowing into a through-hole for a post-attaching component when an electronic component is soldered by flow-soldering without using protective sheet. SOLUTION: An electronic component 4 is mounted on at least one surface of an insulating substrate 1 and soldered to form a printed board P. This printed board P is composed of a first land 6 provided continuously with a through-hole 5 into which the electronic component 4 is soldered in a circuit pattern formed on the printed board P, a second land 9 provided continuously with a through- hole 8 into which a post-attaching component is attached in a circuit pattern and a solder resist layer 3 provided on the surface portion of the second land on the surface on which the electronic component 4 is not mounted.
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