Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls

摘要

The invention relates to a chip holder for forming a chip module (18) comprising a substrate and supply leads placed on the substrate, wherein the supply leads are shaped in the form of strips and extend in a parallel manner along the substrate and wherein the supply leads consist of electrically conductive connecting strips (12, 13) mounted on the substrate and the substrate is formed by a carrier foil (11).