发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive composition showing extremely excellent adhesion performances of so-called hardly bondable materials such as polyolefin materials, for example, polypropylene and polyethylene which have been difficult to bond, since extension in the application range of hot-melt adhesives and a hot-melt adhesive showing excellent adhesion performances have been required. SOLUTION: This hot-melt adhesive composition comprises 5-50 wt.% of (a) an ethylene-vinyl acetate copolymer, 5-50 wt.% of (b) a saponified substance of ethylene-vinyl acetate copolymer, 5-50 wt.% of (c) an ethylene-acrylic acid ester copolymer, 5-40 wt.% of (d) a tackifier resin and <=8 wt.% of (e) an amide wax.
申请公布号 JP2000345128(A) 申请公布日期 2000.12.12
申请号 JP19990154554 申请日期 1999.06.02
申请人 TAOKA CHEM CO LTD 发明人 MATSUDA EIJI;SHIONO HIROYUKI;WAKATSUKI CHIKU
分类号 C09J123/08;C09J131/04;C09J133/08;(IPC1-7):C09J123/08 主分类号 C09J123/08
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