| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for a nonconductor capable of forming a metallic layer on the predetermined face to be plated in a nonconductor without using an electroless plating bath and moreover capable of easily and economically forming a stable plating layer. SOLUTION: A primer coating material contg. a catalyst for electroless plating is applied on the predetermined face to be plated in a nonconductor, drying is executed to form a catalyst-contg. primer coating film, thereafter, a soln. of metallic salt contg. silver, copper or nickel as metallic ions and a soln. of a reducing agent contg. a reducing agent therefor are sprayed from separate spray nozzles to the primer coating film to form a metallic layer capable of electroplating, and then, an electroplating layer is formed on the metallic layer by electroplating treatment.
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