ELECTRONIC COMPONENT SEALING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a small-sized electronic component sealing structure having excellent sealing property in a structure for sealing an electronic component by using a sealing glass. SOLUTION: In this electronic component sealing structure, an electronic component 23 is fixed on an electrode 24 formed on a base 20, covered with a cap 22 and sealed by filling a sealing glass between the cap and the base. The base is provided with a relief region 28 for allowing melted material of the sealing glass 26 heated and melted to be relieved upon sealing.