| 摘要 |
PROBLEM TO BE SOLVED: To obtain a soft adhesive excellent in storage stability, bonding strength, resistance, to heat and moisture, stress relaxation and productibility. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and a block copolymer (C) formed from an aromatic polyamide oligomer containing a phenolic hydroxyl group and having amino aryl groups at both the terminals and a polybutadiene/acrylonitrile copolymer having carboxyl groups at both the terminals Desirably, a content of the block copolymer (C) is 5 to 100 pts.wt. per 100 pts.wt. of the epoxy resin.
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