| 摘要 |
PROBLEM TO BE SOLVED: To enable a copper foil to be easily bonded to the surface of a solid body of resin material by a method wherein a premolded body and a metal foil are melted, molded, and cured into one piece, and the unsused part of the metal foil is removed from the molded body for the formation of a wiring pattern. SOLUTION: Three copper foils 21 prescribed in width are arranged on an lower die, and an uncured pre-molded body 13 is placed thereon. Furthermore, three copper foils 11 which are previously folded and prescribed in width are arranged thereon. In this case, the copper foils 11 and 21 are arranged on the pre-molded body 13 making their rugged surfaces face on the pre-molded body 13, then an upper die 17 is placed thereon, and all the component parts are thermocompressed for two minutes at 180 deg.C under a pressure of 100 kgf/cm2 for thermal curing. That is, the pre-molded body 13 is melted by heating, the copper foils 11 and 21 are firmly bonded to the upper and lower surface of the molded body 13, which is formed into a certain shape as a whole and cured by heating into one piece, and the unused part of the copper foils 11 and 12 is removed for the formation of a wiring pattern.
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