| 摘要 |
An apparatus for feeding chip components is disclosed. The apparatus includes a first component reservoir for storing chip components in bulk, a second component reservoir for two-dimensionally storing the chip components in a space so that the chip components are not overlapped in their thickness direction, and a component alignment path for one-dimensionally aligning the chip components. The apparatus further includes an alignment plate for moving the chip components from the first component reservoir to the component alignment path thorough the second component reservoir by the upward and downward movements of the alignment plate. The apparatus further includes a movable plate, which moves in a predetermined direction when the chip components are caught or drawn between itself and the alignment plate, and a roller device for feeding the chip components in the component alignment path to a predetermined position.
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